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Research Capability Cooperation Patent Layout

Rigid PCB capability

Layer number, material, copper thickness, minimum finish thickness, maximum splice size, minimum aperture, etc
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Flexible Plate Processing Ability

Layer number, base material, thickness of gold core material, thickness of covering film, copper thickness of base material, etc
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IC substrate capability

Minimum plate thickness, minimum through-hole welding PAD, minimum blind-hole welding PAD, minimum line width and line spacing, etc
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SMT capability

Processing capability, component size, maximum component height, component packaging type, mounting capability, etc
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Research Capability Cooperation Patent Layout

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